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Facilities

Heterostructure Assembly

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2D Material Transfer Rigs in Air

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2D Material Transfer Rig in Inert Gas

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2D Material Transfer Rig in Ultrahigh Vacuum (UHV)

Device Fabrication

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Direct-write Optical Lithography (Microtech LW405B)

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Mask Aligner for Optical Lithography (SUSS MicroTec MJB4)

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Scanning Electron Microscopy & Electron-beam Lithography (Zeiss EVO MA-10 with Raith ELPHY Quantum)

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Scanning Electron Microscopy & Electron-beam Lithography
(Zeiss Sigma with Raith ELPHY Quantum)

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Inductively Coupled Plasma Etching (Oxford Instrument Plasmalab System100)

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Inductively Coupled Plasma Etching (Oxford Instruments PlasmaPro 100 Cobra)  

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Soft Plasma Etching (Moorfield nanoETCH)

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UHV Physical Vapour Deposition (Magnetron Sputtering & Electron-beam Evaporation) (PREVAC) 

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Electron-beam Physical Vapour Deposition (Moorfield MiniLab 080)

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Thermal Evaporation (Moorfield MiniLab)

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Magnetron Sputtering (AJA Orion) 

Characterisation

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Raman Spectroscopy (Horiba XploRA PLUS)

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Atomic Force Microscopy (Asylum Research Cypher S)

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Atomic Force Microscopy (Bruker Dimension Icon & FastScan)

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Cryogenic Scanning Tunneling Microscopy
(RHK PanScan Freedom)

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Cryo-Free Cryostat with Superconducting Magnet

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Cryo-Free Dilution Refrigerator

Cypher - Scanning Probe Microscopy (SPM)

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